Products
Qantur
Ansys SIwave
Signal Integrity, Power Integrity, and
EMI Analysis for PCB Design
Dedicated PCB & Package Electromagnetics Simulation Software
- Full-Wave SI/PI Extraction
- Impedance / Crosstalk / EMI Scanning
- Feature: Virtual
- Electro-Thermal Design
Features
Product Specs
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Layout and Geometry Import
Electrothermal Analysis
High-Performance Computing
IBIS and IBIS-AMI SerDes Analysis
Virtual Compliance
Automated Decoupling Capacitor
Impedance and Crosstalk Scanning
Multidomain System Modeling
Electromigration Analysis
EMI Solution
Capabilities
SIwave leverages advanced electromagnetic, thermal and mechanical simulators to dynamically link circuit and system simulation
Successful design of next-generation electronic products requires power integrity, signal integrity and thermal integrity co-analysis. SIwave uniquely handles the complexity of interconnect design from die-to-die across ICs, packages, connectors and boards.
SIwave enables electronics companies to achieve a competitive advantage with faster time to market, reduced costs and improved system performance.
Capabilities
Structures Capabilities
Easily handle the complexity of varied design environments with a range of analytical tools that enable you to meet performance goals and ensure long-term reliability.
Full-wave SI/PI Extraction

SIwave includes a combination of integrated solvers for fast and accurate SI/PI extraction of complete high-speed PCB and Package design.
There are various extraction types supported by SIwave such as IC packaging RLCG IBIS for signals and power, touch panel RLCG unit cell, bus bar RLCG, power inverter/converter, and a specialized thin-plane solver for touch panel extractions.
Impedance/Crosstalk/EMI scanning

The impedance and crosstalk scanner provide accurate field-solver characteristic impedances and coupling coefficients for traces within PCBs and packages.
EMI Scanner and EMI Xplorer provide automatic and customizable EMI design rule checks to quickly identify areas of potential interference on the design prior to simulation.
Virtual Compliance

SIwave enables you to determine if your design will pass or fail according to specific communication protocol standards.
Ansys SIwave provides a DDR virtual compliance kit which in combination with DDR Wizard provides an end-to-end virtual compliance for designs using DDR technology. Additionally, our new SPISim technology allows for simple compliance reporting for USB-C and COM calculations for IEEE 802.3bj and 802.3bs channels. The programming environment also enables customization and support to add eye masks and limit lines for different type of standards.
Electrothermal and Mechanical Analysis

SIwave links to the Ansys software portfolio for multiphysics simulation of electronic components. One option is to export a power distribution map from SIwave into Ansys Icepak.
This multiphysics solution enables accurate thermal modeling of IC packages and PCBs using DC power loss from SIwave as a heat source. Icepak solves the challenges associated with dissipation of thermal energy from electronic components that may cause premature component failure due to overheating. You can then evaluate thermal stress with Ansys Mechanical. This multiphysics approach enables you to perform coupled EM–thermal–stress analysis for a complete understanding of the design prior to manufacturing.
Visioneering
Recent Events &
Webinars
Discover how engineering simulation is expanding across the entire product lifecycle.
Ansys Multiphysics
Conference
Join us on Saturday, June 10th, 2023, at 3 PM. The event will take place at Riverside Park, 123 River Lane, Springfield.
Blog
Future Tech Expo 2025
Join us on Saturday, June 10th, 2023, at 3 PM. The event will take place at Riverside Park, 123 River Lane, Springfield.

Blog
Innovative Simulations
Summit 2025
Join us on Saturday, June 10th, 2023, at 3 PM. The event will take place at Riverside Park, 123 River Lane, Springfield.

Innovative Simulations
Summit 2025
Join us on Saturday, June 10th, 2023, at 3 PM. The event will take place at Riverside Park, 123 River Lane, Springfield.
Ansys Multiphysics
Conference
Join us on Saturday, June 10th, 2023, at 3 PM. The event will take place at Riverside Park, 123 River Lane, Springfield.
Blog
Innovative Simulations
Summit 2025
Join us on Saturday, June 10th, 2023, at 3 PM. The event will take place at Riverside Park, 123 River Lane, Springfield.

Visioneering
Blogs & Trends
Discover how engineering simulation is expanding across the entire product lifecycle. engineering / product design analysis by modeling & simulation.

Innovative Simulations Summit 2024
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Ansys Multiphysics Conferences
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Ansys Multiphysics Conferences
Introduction Mi tincidunt elit, id quisque ligula ac diam, amet. Vel etiam suspendisse morbi eleifend faucibus eget vestibulum felis. Dictum quis montes, sit sit. Tellus aliquam enim urna, etiam. Mauris

Innovative Simulations Summit 2024
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Innovate
Breaking News & White Paper
Discover how engineering simulation is expanding across the entire product lifecycle.

Smart Strategies for Large Structural Simulations
One way to gauge the progress of engineering simulation software is through the lens of size. Engineers today routinely run structural simulations with a few million degrees of freedom, and the largest commercial structural simulations have topped even 100 million degrees of freedom.
Introduction Mi tincidunt elit, id quisque ligula ac diam, amet. Vel etiam suspendisse morbi eleifend faucibus eget vestibulum felis. Dictum quis montes, sit sit. Tellus
Introduction Mi tincidunt elit, id quisque ligula ac diam, amet. Vel etiam suspendisse morbi eleifend faucibus eget vestibulum felis. Dictum quis montes, sit sit. Tellus
Introduction Mi tincidunt elit, id quisque ligula ac diam, amet. Vel etiam suspendisse morbi eleifend faucibus eget vestibulum felis. Dictum quis montes, sit sit. Tellus
Services
Case Studies
Qantur Technologies is a pioneer engineering simulations company based in Gurgaon –India. We provides expert Computer Aided Engineering – CAE consulting services for engineering / product design analysis by modeling & simulation.
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