Products

Qantur

Ansys Icepak Cooling
Simulation Software for Electronic Components

Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics.
Overview

Electronics Cooling & PCB Thermal Simulation and Analysis

Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI).

Features

Product Specs

Perform conduction, convection and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection.

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MCAD and ECAD Support

Network Modeling

Liquid Cooling

Solar radiation

DC Joule Heating Analysis

Dynamic Thermal Management

Parametrics and Optimization

Electro-thermal and Thermo-Mechanical

Varying Flow and Power ROM

Customization and Automation

Extensive Libraries for Thermal

Capabilities

Predict airflow, temperature and heat transfer for electronics assemblies and printed circuit boards

With CAD-centric (mechanical and electrical CAD) and multiphysics user interfaces, Icepak facilitates the solving of today’s most challenging thermal management problems in electronics products and assemblies. Icepak uses sophisticated CAD healing, simplification and metal fraction algorithms that reduce simulation times, while providing highly accurate solutions that have been validated against real-world products. The solution’s high degree of accuracy results from the highly automated, advanced meshing and solver schemes, which ensure a true representation of the electronics application.

Capabilities

Structures Capabilities

Easily handle the complexity of varied design environments with a range of analytical tools that enable you to meet performance goals and ensure long-term reliability.

Heat can degrade the performance and reliability of electronic devices.

Power dissipation of ICs and power losses across the board are key inputs for thermal analysis.

Ansys’ industry leading computational fluid dynamics (CFD) solutions, along with chip-level thermal integrity simulation software, provide all you need to perform electronics cooling simulation and thermal analysis for chip-package, PCB and systems.

You can also conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution. Our integrated workflow enables you to conduct design trade-offs, resulting in improved reliability and performance.

Tight synergy with SIwave, Ansys Mechanical and Sherlock enables Icepak to accurately predict temperature rise using precise geometries and electrical inputs.

Icepak users can easily assemble automated workflows within the Ansys ecosystem to complete multiphysics analyses for electromigration, dielectric breakdown and multi-axial solder joint fatigue.

Visioneering

Recent Events &
Webinars

Discover how engineering simulation is expanding across the entire product lifecycle.

Ansys Multiphysics
Conference

Join us on Saturday, June 10th, 2023, at 3 PM. The event will take place at Riverside Park, 123 River Lane, Springfield.

Blog

Future Tech Expo 2025

Join us on Saturday, June 10th, 2023, at 3 PM. The event will take place at Riverside Park, 123 River Lane, Springfield.

Blog

Innovative Simulations
Summit 2025

Join us on Saturday, June 10th, 2023, at 3 PM. The event will take place at Riverside Park, 123 River Lane, Springfield.

Innovative Simulations
Summit 2025

Join us on Saturday, June 10th, 2023, at 3 PM. The event will take place at Riverside Park, 123 River Lane, Springfield.

Ansys Multiphysics
Conference

Join us on Saturday, June 10th, 2023, at 3 PM. The event will take place at Riverside Park, 123 River Lane, Springfield.

Blog

Innovative Simulations
Summit 2025

Join us on Saturday, June 10th, 2023, at 3 PM. The event will take place at Riverside Park, 123 River Lane, Springfield.

Visioneering

Blogs & Trends

Discover how engineering simulation is expanding across the entire product lifecycle. engineering / product design analysis by modeling & simulation.

Ansys Multiphysics Conferences

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Ansys Multiphysics Conferences

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Innovate

Breaking News & White Paper​

Discover how engineering simulation is expanding across the entire product lifecycle.

Smart Strategies for Large Structural Simulations

One way to gauge the progress of engineering simulation software is through the lens of size. Engineers today routinely run structural simulations with a few million degrees of freedom, and the largest commercial structural simulations have topped even 100 million degrees of freedom.

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Introduction Mi tincidunt elit, id quisque ligula ac diam, amet. Vel etiam suspendisse morbi eleifend faucibus eget vestibulum felis. Dictum quis montes, sit sit. Tellus

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Services

Case Studies

Qantur Technologies is a pioneer engineering simulations company based in Gurgaon –India. We provides expert Computer Aided Engineering – CAE consulting services for engineering / product design analysis by modeling & simulation.

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Testimonials

Customer Testimonials

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