Industries
Electronics and Semiconductors
Modeling and simulation are proven ways to address the high and unsustainable costs and time required for design and regulatory approval of increasingly complex healthcare solutions. This in silico approach maximizes patient safety while making healthcare more affordable.
Accelerating Innovation in Healthcare With In Silico Medicine
The electronics and semiconductor industry is pivotal in shaping modern technology and supporting innovations in fields like computing, telecommunications, and consumer electronics. Ansys provides a suite of simulation solutions to address key engineering needs: Ansys HFSS for electromagnetic field simulations in high-frequency designs, Ansys SIwave for signal and power integrity analysis, Ansys Icepak for thermal management of electronic devices, Ansys Mechanical for structural analysis of components, and Ansys Q3D Extractor for parasitic extraction in high-frequency circuits. These tools along with other Ansys products help engineers optimize electronic systems for enhanced performance and reliability.
- Ansys HFSS
- Ansys SIwave
- Ansys Icepak
- Ansys Mechanical
- Ansys Q3D Extractor
PCB (Printed Circuit Board)
ANSYS provides advanced simulation tools to address the growing complexity of PCB design, ensuring signal integrity, thermal reliability, and electromagnetic compatibility. Its multiphysics capabilities allow comprehensive analysis from layout to performance under real-world conditions.
Electromagnetic simulations to optimize signal integrity and ensure electromagnetic compatibility (EMC).
Thermal analysis to prevent component overheating and enhance system reliability.
Structural analysis to ensure the durability and strength of PCB assemblies under various operational conditions.
Component-Level Capabilities
ANSYS supports simulation of PCB layers, traces, vias, solder joints, connectors, and components. Key capabilities include signal integrity (SI), power integrity (PI), thermal management, electromagnetic interference (EMI/EMC), and mechanical stress analysis to ensure high performance and reliability.
Traces and Vias
- Simulate electromagnetic performance to ensure signal integrity and prevent interference.
- Conduct thermal analysis to prevent localized overheating of traces and vias.
Connectors
- Test the mechanical strength and durability of connectors to ensure reliable connections.
- Simulate electrical performance to assess signal and power integrity, and minimize electromagnetic interference.
PCB Layers and Stack-up
- Simulate signal propagation to optimize layer stack-up design for minimal signal loss.
- Perform drop test, vibration analysis, and thermal analysis to ensure reliability.
Relevant Ansys Software
ANSYS offers a powerful suite of tools including SIwave, Icepak, HFSS, Mechanical, and Sherlock for complete PCB development.
These tools allow design teams to simulate electrical behavior, heat dissipation, structural integrity, and long-term reliability of printed circuit boards.
Ansys RedHawk-SC
Provides an industry-standard solution for voltage drop and electromigration analysis in digital designs.
RF/Microwave Design
ANSYS delivers high-fidelity simulation tools to support the design and optimization of RF and microwave components. From antennas and filters to waveguides and full system performance, ANSYS ensures signal accuracy, minimal losses, and regulatory compliance across high-frequency applications.
Electromagnetic simulations to optimize RF and microwave circuit designs for performance and efficiency.
Structural analysis for the durability of RF components under operational stresses.
Thermal simulations to analyze heat dissipation and to prevent overheating of high-frequency components.
Component-Level Capabilities
ANSYS enables precise modeling of antennas, transmission lines, filters, PCBs, RF IC packages, connectors, and waveguides. Capabilities include S-parameter extraction, radiation patterns, impedance matching, EMI/EMC analysis, and thermal behavior—all essential for efficient RF/Microwave system design.
Antennas
- Simulate far and near electromagnetic fields to optimize antenna performance for signal transmission and reception.
- Analyze the structural strength of antennas to ensure durability and reliability over time.
Filters
- Perform sensitivity, power handling, dispersion and coupling matrix calculations to optimize the filter design.
- Conduct thermal drift and power handling analysis of filters to ensure consistent performance and reliability.
Relevant Ansys Software
ANSYS offers industry-leading tools including HFSS, Designer, Icepak, Mechanical, and EMA3D Cable.
These solutions enable full electromagnetic simulation, thermal management, structural integrity, and RF system integration—ideal for wireless, aerospace, radar, satellite, and communication applications
HFSS3D electromagnetic simulation for high-frequency components.
Thermal management simulation for electronics cooling solutions.Icepak
Ansys Additive Suite
Simulates additive manufacturing processes for fabricating custom RF components, such as waveguides and antenna structures with complex geometries.
Ansys Maxwell
Simulates electromagnetic fields for inductive elements in RF systems, optimizing their design for power efficiency and performance.
Ansys RedHawk-SC
Performs voltage drop and electromigration analysis in digital IC designs used in RF systems, ensuring power integrity and reliability.
Integrated Circuit (IC)
ANSYS offers powerful simulation solutions tailored for the complex demands of modern IC design. From electromagnetic and thermal analysis to signal and power integrity, ANSYS ensures optimal performance, reliability, and compliance in advanced semiconductor applications.
Electromagnetic simulations for power and signal integrity optimization in ICs.
Electrothermal analysis to prevent overheating and ensure reliable operation of ICs.
Electrostatic discharge (ESD) and reliability analysis to safeguard ICs against transient voltage events and ensure long-term operational stability.
Structural analysis to ensure durability and reliability of IC packages under mechanical stresses.
Component-Level Capabilities
ANSYS supports comprehensive simulation of IC components including transistors, interconnects, bonding wires, power delivery networks, and 3D-IC packaging. Capabilities include thermal analysis, parasitic extraction, power integrity, electromigration prediction, and signal timing optimization across nanometer-scale nodes.
Transistors
- Perform signal and power integrity analysis to ensure optimal switching performance and reliable operation in high-speed circuits.
- Conduct thermal analysis to mitigate localized heating and ensure stable operation under high-power conditions.
Capacitors and Inductors
- Analyze parasitic effects to reduce signal distortion and enhance circuit performance.
- Assess thermal and electrical performance under varying loads to ensure long-term stability and reliability.
Interconnects
- Perform signal integrity analysis to optimize high-speed signal propagation and minimize latency in advanced IC designs.
- Conduct structural simulations to evaluate the performance of interconnects under thermal and mechanical stresses.
Relevant Ansys Software
ANSYS provides industry-trusted tools like RedHawk-SC, Totem, PathFinder, RaptorX, and Icepak.
These tools help simulate full-chip thermal effects, voltage drop, reliability under stress, and package-level electromagnetic interference—ensuring robust IC performance from design to tape-out.
Ansys RedHawk-SC
Provides industry-standard voltage drop and electromigration analysis for digital IC designs, enabling what-if explorations and optimization of power and performance.
Ansys Additive Suite
Simulates additive manufacturing processes for creating custom IC packaging and cooling solutions with complex geometries.
Embedded Systems
ANSYS delivers advanced simulation solutions designed to address the unique challenges of embedded system development. From hardware-software co-design and real-time performance validation to electromagnetic compatibility and thermal management, ANSYS ensures that embedded systems meet stringent functional, reliability, and safety requirements in diverse application domains including automotive, aerospace, IoT, and industrial automation.
Electromagnetic simulations for signal and power integrity, and EMC in embedded systems.
Electrothermal analysis to ensure optimal operating temperatures and prevent overheating of embedded components.
Structural analysis to ensure the durability and reliability of embedded systems in various environments.
Software-in-the-loop (SIL) and Hardware-in-the-loop (HIL) simulations to validate software performance and control algorithms under real-world operating conditions.
Component-Level Capabilities
ANSYS supports detailed simulation of embedded system components such as microcontrollers, sensors, actuators, communication interfaces, and power modules. Capabilities include hardware-software integration verification, signal integrity analysis, thermal profiling, electromagnetic interference (EMI) mitigation, and fault diagnosis. This enables developers to optimize embedded designs for power efficiency, real-time responsiveness, and long-term durability.
Microcontrollers
- Simulate signal integrity to ensure accurate data processing and reliable communication between components within the system.
- Perform software-in-the-loop (SIL) and hardware-in-the-loop (HIL) simulations to test the performance of embedded software and validate control algorithms in real-time conditions.
Sensors
- Simulate electromagnetic compatibility/interference (EMC/EMI) to ensure the sensor's ability to operate without interference from external signals and minimize noise.
- Perform signal integrity analysis to guarantee accurate data collection and reliable performance in varying electromagnetic environments.
Communication Modules
- Simulate EMI/EMC to ensure reliable communication and prevent interference in embedded communication systems.
- Analyze signal integrity to ensure robust data transmission, minimizing signal degradation and optimizing data flow.
Relevant Ansys Software
ANSYS provides specialized tools such as SCADE for model-based embedded software development, Twin Builder for system-level simulation, HFSS for electromagnetic analysis, and Icepak for thermal management. These tools facilitate end-to-end embedded system validation, from code generation and hardware emulation to physical environment modeling, ensuring seamless integration and compliance with industry standards.
Ansys RedHawk-SC
Delivers power integrity and electromigration analysis for IC designs in embedded systems, ensuring reliability in advanced electronics.
Ansys Additive Suite
Simulates additive manufacturing processes for creating custom components like enclosures and heatsinks for embedded systems.
Photonics and Optoelectronics
ANSYS offers cutting-edge simulation solutions specifically tailored for photonics and optoelectronics design challenges. These solutions enable engineers to accurately model light-matter interactions, optical wave propagation, and electro-optical device behavior—ensuring high performance, efficiency, and integration in applications ranging from telecommunications and data centers to sensing and medical devices.
Electromagnetic simulations to optimize optical performance in photonic devices.
Thermal analysis to ensure reliable operation and prevent overheating.
Structural analysis to ensure the durability of photonics components under operational stresses.
Component-Level Capabilities
ANSYS supports comprehensive simulation of photonic components such as waveguides, modulators, lasers, photodetectors, and integrated optical circuits. Capabilities include optical mode analysis, photonic crystal design, nonlinear optics, thermal effects on optical performance, and co-simulation with electronic circuits. This empowers designers to optimize device efficiency, minimize losses, and ensure signal integrity at the nanoscale.
Laser Diodes
- Simulate optical behaviour to ensure precision and reliability in laser diode applications.
- Perform thermal analysis to prevent overheating and performance degradation.
Photodetectors
- Simulate electromagnetic performance to optimize the response of photodetectors to light and ensure accurate signal detection.
- Conduct thermal analysis to manage heat dissipation and prevent performance degradation in photodetectors.
Optical Fibers
- Simulate light propagation to optimize light transmission and minimize signal loss in optical fibers.
- Perform structural analysis to evaluate the mechanical durability and long-term reliability of optical fibers under operational stresses.
- Simulate light output to ensure high efficiency in lighting applications.
- Perform thermal analysis to prevent overheating in high-power LED systems.
Relevant Ansys Software
ANSYS provides specialized tools like Lumerical for photonic device simulation, HFSS for electromagnetic field analysis, and SPEOS for optical system simulation. These platforms enable full-wave electromagnetic modeling, multiphysics optimization, and system-level optical performance evaluation—helping accelerate innovation in photonics from component design to system integration.
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Still have a Question?
FAQ
How can ANSYS improve the performance of my automotive designs?
ANSYS allows for detailed simulation and analysis, enabling optimization of factors like aerodynamics, structural integrity, and thermal management. This leads to better performing and more efficient vehicles.
Can ANSYS help reduce the time and cost of automotive development?
Yes, by providing accurate virtual testing, ANSYS reduces the need for physical prototypes and testing cycles. This leads to faster development times and significant cost savings.
What types of automotive simulations can ANSYS perform?
ANSYS can handle a wide range of simulations, including crash analysis, fluid dynamics for aerodynamics, thermal analysis for engine cooling, and NVH analysis for noise reduction.
Is ANSYS compatible with my existing CAD software?
ANSYS is designed to integrate with most standard CAD software, ensuring a smooth workflow. We support common file formats for easy data transfer and interoperability
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Testimonials
Customer Testimonials
Bengal Industries Pvt. Ltd
The ANSYS Mechanical training conducted by Qantur Technologies was highly informative and helped our engineers resolve critical challenges in contact modeling, meshing, and fatigue analysis. The sessions were well-coordinated, delivered on schedule, and supported with patient guidance by the trainer and account manager. We truly value Qantur’s expertise, professionalism, and post-sales support.
Bengal Industries Pvt. Ltd
Bliss Anand Pvt. Ltd.
During our evaluation of CFD solutions, Qantur Technologies stood out for their technical expertise, reliability, and customer-focused approach. Their consulting projects achieved 98% accuracy compared to experimental values, instilling strong confidence in their capabilities. Based on this experience, we selected them as our preferred partner for ANSYS software, consulting, training, and support. We highly recommend their services to organizations with simulation requirements.
Bliss Anand Pvt. Ltd.
CUET, Department of Mechanical Engineering
We experienced significant value from Qantur Technologies’ expertise in ANSYS solutions, particularly in FEA and CFD consulting. Their skilled engineers provided insightful training on geometry, meshing, and modeling, which enhanced our students’ and faculty’s analytical skills. With exceptional support and patience from their trainers, we are pleased to recommend Qantur Technologies for ANSYS implementation, training, and advanced simulation services.
CUET, Department of Mechanical Engineering
Entecnia Consulting Pvt. Ltd.
Our collaboration with Qantur Technologies for ANSYS implementation and consulting has been outstanding. Their commitment, technical expertise, and timely support in FEA and CFD have added significant value to our engineering and R&D teams. The exclusive 15-day training session further enhanced our team’s analytical skills, and we truly appreciate their professionalism and ownership in managing the entire process seamlessly. We highly recommend Qantur Technologies for advanced CAE solutions.
Entecnia Consulting Pvt. Ltd.
Flovel Energy Pvt. Ltd.
Our experience with Qantur Technologies in implementing ANSYS HPC and CFD solutions has been remarkable. Their skilled engineers conducted in-depth training for our R&D team, equipping us with advanced methods to simulate hydro turbines and enhance component performance. Their reliable support, technical expertise, and resource assistance make them a trusted partner for ANSYS software, consulting, and training. We highly recommend Qantur Technologies for any ANSYS-related services.
Flovel Energy Pvt. Ltd.
Flovel Energy Pvt. Ltd.
We truly value the ANSYS SpaceClaim training conducted by Qantur Technologies at our R&D center. The course was tailored to our requirements, highly informative, and supported by hands-on workshops that enhanced our team’s modeling skills. Their application engineer was proactive, helpful, and ensured customization aligned with our needs. We look forward to engaging Qantur Technologies again for future application-based trainings.
Flovel Energy Pvt. Ltd.
IoTechWorld Avigation Pvt. Ltd.
At IoTechWorld, we develop advanced drones for agriculture, survey, and surveillance, and ANSYS Mechanical & CFD have been instrumental in optimizing our designs. Qantur Technologies supported us with the right resources, training, and technical expertise to address complex FEA & CFD challenges. Their team’s commitment and knowledge have empowered us to innovate faster and more effectively. We highly recommend Qantur Technologies for ANSYS implementation, consulting, and support.
IoTechWorld Avigation Pvt. Ltd.
Karman Drones Pvt. Ltd.
Our collaboration with Qantur Technologies for At Karman Drones, innovation drives our mission in AI-powered autonomous drones. Qantur Technologies has been a key partner in implementing ANSYS software, providing outstanding FEA & CFD expertise, consulting, and hands-on training. Their engineers have empowered our team with advanced simulation knowledge, improving design validation, performance optimization, and overall efficiency. We highly recommend Qantur Technologies for their exceptional support and technical proficiency.
Karman Drones Pvt. Ltd.
Mittal Electronics
At Mittal Electronics, innovation and R&D are at the heart of our product development. Partnering with Qantur Technologies for ANSYS FEA & CFD has been transformative—helping us accelerate design validation, optimize performance, and tackle complex engineering challenges with confidence. Their expert training, consulting, and quick response have greatly strengthened our engineering capabilities. We look forward to continued collaboration with Qantur Technologies.
Mittal Electronics
MV Electrosystems Pvt. Ltd.
At MV Electrosystems, innovation in rail transportation demands precision and reliability. Partnering with Qantur Technologies for ANSYS ICEPAK & Mechanical has significantly enhanced our ability to optimize product design, improve efficiency, and accelerate development. Their expert training, technical guidance, and hands-on support in FEA & CFD not only strengthened our engineering skills but also deepened our understanding of core physics. We truly value this collaboration and highly recommend Qantur Technologies for simulation-driven innovation.
MV Electrosystems Pvt. Ltd.
Nicotra India Pvt. Ltd.
At Nicotra India, precision in fan design is critical. Qantur Technologies has been a valuable partner, providing quick and responsive CFD support—both onsite and online—that helped us validate designs and solve complex meshing and model setup challenges. Their extensive training sessions empowered our R&D team with practical simulation expertise, strengthening our analytical and design capabilities. We are pleased with their services and highly recommend them for ANSYS implementation and technical support.
Nicotra India Pvt. Ltd.
NTF (India) Pvt. Ltd.
At NTF India, we rely on advanced engineering solutions to deliver world-class automotive components. Qantur Technologies has been a trusted partner, supporting us with ANSYS implementation and in-depth FEA analysis for our key projects. Their professionalism, technical expertise, and ability to deliver under challenging conditions have consistently exceeded our expectations. We highly value their commitment and look forward to continued collaboration on future product development initiatives.
NTF (India) Pvt. Ltd.
Onassis Auto Limited
At Onassis Auto, precision and reliability are at the core of our automotive components. With Qantur Technologies’ guidance in Ansys Mechanical, we have successfully enhanced our engineering capabilities, optimized transmission components, and improved efficiency. Their hands-on training, prompt support, and expertise in FEA have greatly empowered our R&D team. We are pleased to recommend Qantur Technologies for their outstanding technical services and commitment.
Onassis Auto Limited
P2P Analysis & Solutions
At P2P Analysis & Solutions, innovation is our core, and Qantur Technologies has been an invaluable partner in this journey. Their technical excellence in Ansys Mechanical and LS-DYNA, coupled with meticulous training and proactive support, has empowered our team to solve complex challenges with confidence. Their professionalism, collaborative approach, and customer-centric commitment make them a trusted long-term partner. We strongly recommend Qantur Technologies for any Ansys-related solutions and services.
P2P Analysis & Solutions
S&O Marintime
S&O Marintime
