Ansys Icepak Cooling
Simulation Software for Electronic Components

Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics.

Overview

Electronics Cooling & PCB Thermal Simulation and Analysis

Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI).

Features

Product Specs

Perform conduction, convection and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection.

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MCAD and ECAD Support

Network Modeling

Liquid Cooling

Solar radiation

DC Joule Heating Analysis

Dynamic Thermal Management

Parametrics and Optimization

Electro-thermal and Thermo-Mechanical

Varying Flow and Power ROM

Customization and Automation

Extensive Libraries for Thermal

Capabilities

Predict airflow, temperature and heat transfer for electronics assemblies and printed circuit boards

With CAD-centric (mechanical and electrical CAD) and multiphysics user interfaces, Icepak facilitates the solving of today’s most challenging thermal management problems in electronics products and assemblies. Icepak uses sophisticated CAD healing, simplification and metal fraction algorithms that reduce simulation times, while providing highly accurate solutions that have been validated against real-world products. The solution’s high degree of accuracy results from the highly automated, advanced meshing and solver schemes, which ensure a true representation of the electronics application.

Capabilities

Structures Capabilities

Easily handle the complexity of varied design environments with a range of analytical tools that enable you to meet performance goals and ensure long-term reliability.

Electrothermal Analysis of a PCB

Heat can degrade the performance and reliability of electronic devices.

Power dissipation of ICs and power losses across the board are key inputs for thermal analysis.

Electronics Cooling

Ansys’ industry leading computational fluid dynamics (CFD) solutions, along with chip-level thermal integrity simulation software, provide all you need to perform electronics cooling simulation and thermal analysis for chip-package, PCB and systems.

You can also conduct thermomechanical stress analysis and airflow analysis to select the ideal heat sink or fan solution. Our integrated workflow enables you to conduct design trade-offs, resulting in improved reliability and performance.

Thermal Reliability

Tight synergy with SIwave, Ansys Mechanical and Sherlock enables Icepak to accurately predict temperature rise using precise geometries and electrical inputs.

Icepak users can easily assemble automated workflows within the Ansys ecosystem to complete multiphysics analyses for electromigration, dielectric breakdown and multi-axial solder joint fatigue.